The Dimensity 7050, MediaTek's newest chipset and a part of the Dimensity 7000 family, was introduced quietly. By renaming the current Dimensity 700, 800, and 900 ranges as the new Dimensity 7000 and 6000 series, the SoC significantly streamlines the market. Check out the information below.
MediaTek Dimensity 7050: All Details
The most recent MediaTek Dimensity 7050 chipset features a CPU with two powerful 2.6GHz Cortex-A78 cores and six energy-efficient 2.0GHz Cortex-A55 cores. It also uses TSMC's cutting-edge 6nm process technology. It has a Mali-G68 MC4 GPU and can support UFS 3.1/2.1 storage standards as well as LPDDR5/4x memory.
The chipset can drive FHD+ displays with refresh rates of 120Hz and resolutions of up to 2520 x 1080 pixels. Up to 200MP cameras and 4K HDR video recording are supported. The MediaTek APU 550 is compatible with a number of AI-based camera improvements.
The chipset supports two 5G SIM cards, Wi-Fi 6, Bluetooth 5.2, GLONASS, and MediaTek's 5G UltraSave power-saving suite, among other capabilities. Additionally, the Dimensity 7050 gains playback compatibility with HEVC, H.264, MPEG-1/2/4, and VP-9 codecs as well as HEVC and H.264 format encoding support.
The Realme 11 Series is scheduled to debut in China on May 10 and is expected to be the first device to feature the Dimensity 7050. With the newest MediaTek Dimensity 7050 SoC and 12GB of RAM, the Realme 11 Pro+ recently surfaced on Geekbench. Additionally, it has been claimed that the new Dimensity 7050 chipset is actually the Dimensity 1080 5G chipset under a different name.
The Realme 11 series, which is anticipated to include the Realme 11 Pro and the Realme 11 Pro+, will feature a lychee leather back design and a large circular camera bump on the back. Although there is no confirmation, the Realme 11 may also come in its original form. Keep checking back for new updates as they become available.